State-of-the-art inspection is key to ensuring quality, so we have installed the revolutionary ERSASCOPE Inspection System 300. This system offers a cross-sectional non-destructive visual image of hidden solder joints by looking beneath the BGA. With this tool, we can quickly inspect all types of BGA, MicroBGA, and Flip-Chip components.
We Design Practical BGA Reballing stencils and holders to manually rework BGA components to there original condition.
Quick, cost effective quality BGA, CSP reballing services.
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We can focus on and see interior balls in the middle of the BGA. Magnification can be up to 330X. |
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Fiberoptic backlighting allows rapid, optimal visual inspection. |
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We can inspect a flip chip with a standoff height as low as 20 microns or .001". |
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We employ X-ray inspection technology for BGA rework and service. |
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The integrated system software allows our technicians to automatically measure distance, angle, volume and area values. |
